半导体词汇
| ACA Anisotropic Conductive Adhesive 各向异性导电胶 ACAF Anisotropic Conductive Adhesive Film各项异性导电胶膜 Al Aluminium 铝 ALIVH All Inner Via Hole 完全内部通孔 AOI Automatic Optial Inspection 自动光学检查 ASIC Application Specific Integrated Circuit 专用集成电路 ATE Automatic Test Equipment 自动监测设备 AU Gold 金 BCB Benzocyclohutene,Benzo Cyclo Butene 苯丙环丁烯 BEO Beryllium Oxide 氧化铍 BIST Built-In Self-Test() 内建自测试(功能) BIT Bipolar Transistor 双极晶体管 BTAB Bumped Tape Automated Bonding 凸点载带自动焊 BGA Ball Grid Array 焊球阵列 BQFP Quad Flat Package With Bumper 带缓冲垫的四边引脚扁平封装 C4 Controlled Collapsed Chip Connection 可控塌陷芯片连接 CAD Computer Aided Design 计算机辅助设计 CBGA Ceramic Ball Grid Array 陶瓷焊球阵列 CCGA Ceramic Column Grid Array 陶瓷焊柱阵列 CLCC Ceramic Leaded Chip Carrier 带引脚的陶瓷片式载体 CML Current Mode Logic 电流开关逻辑 CMOS Complementary l-Oxide-Semiconductor 互补金属氧化物半导体 COB Chip on Board 板上芯片 COC Chip on Chip 叠层芯片 COG Chip on Glass 玻璃板上芯片 CSP Chip Size Package 芯片尺寸封装 CTE Coefficient of Thermal Expansion 热膨胀系数 CVD Chemical Vapor Depositon 化学汽相淀积 DCA Direct Chip Attach 芯片直接安装 DFP Dual Flat Package 双侧引脚扁平封装 DIP Double In-Line Package 双列直插式封装 DMS Direct llization System 直接金属化系统 DRAM Dynamic Random Access Memory 动态随机存取存贮器 DSO Dual Small Outline 双侧引脚小外形封装 DTCP Dual Tape Carrier Package 双载带封装 3D Three-Dimensional 三维 2D Two-Dimensional 二维 EB Electron Beam 电子束 ECL Emitter-Coupled Logic 射极耦合逻辑 FC Flip Chip 倒装片法 FCB Flip Chip Bonding 倒装焊 FCOB Flip Chip on Board 板上倒装片 FEM Finite Element Method 有限元法 FP Flat Package 扁平封装 FPBGA Fine Pitch Ball Grid Array 窄节距BGA FPD Fine Pitch Device 窄节距器件 FPPQFP Fine Pitch Plastic QFP 窄节距塑料QFP GQFP Guard-Ring Quad Flat Package 带保护环的QFP HDI High Density Interconnect 高密度互连 HDMI High Density Multilayer Interconnect 高密度多层互连 HIC Hybird Integrated Circuit 混合集成电路 HTCC High Temperature Co-Fired Ceramic 高温共烧陶瓷 HTS High Temperature Storage 高温贮存 IC Integrated Circuit 集成电路 IGBT Insulated Gate Bipolar Transistor 绝缘栅双极晶体管 ILB Inner-Lead Bond 内引脚焊接 I/O Input/Output 输入/输出 IVH Inner Via Hole 内部通孔 JLCC J-Leaded Chip Carrier J形引脚片式载体 KGD Known Good Die 优质芯片 LCC Leadless Chip Carrier 无引脚片式载体 LCCC Leadless Ceramic Chip Carrier 无引脚陶瓷片式载体 LCCP Lead Chip Carrier Package 有引脚片式载体封装 LCD Liquid Crystal Display 液晶显示器 LCVD Laser Chemical Vapor Deposition 激光化学汽相淀积 LDI Laser Direct Imaging 激光直接成像 LGA Land Grid Array 焊区阵列 LSI Large Scale Integrated Circuit 大规模集成电路 LOC Lead Over Chip 芯片上引线健合 LQFP Low Profile QFP 薄形QFP LTCC Low Temperature Co-Fired Ceramic 低温共烧陶瓷 MBGA l BGA 金属基板BGA MCA Multiple Channel Access 多通道存取 MCM Multichip Module 多芯片组件 MCM-C MCM with Ceramic Substrate 陶瓷基板多芯片组件 MCM-D MCM with Deposited Thin Film Inteconnect Substrate 淀积薄膜互连基板多芯片组件 MCM-L MCM with Laminated Substrate 叠层基板多芯片组件 MCP Multichip Package 多芯片封装 MELF l Electrode Face Bonding 金属电极表面健合 MEMS Microelectro Mechanical System 微电子机械系统 MFP Mini Flat Package 微型扁平封装 MLC Multi-Layer Ceramic Package 多层陶瓷封装 MMIC Monolithic Microwave Integrated Circuit 微波单片集成电路 MOSFET l-Oxide-Silicon Field-Effect Transistor 金属氧化物半导体场效应晶体管 MPU Microprocessor Unit 微处理器 MQUAD l Quad 金属四列引脚 MSI Medium Scale Integration 中规模集成电路 OLB Outer Lead Bonding 外引脚焊接 PBGA Plastic BGA 塑封BGA PC Personal Computer 个人计算机 PFP Plastic Flat Package 塑料扁平封装 PGA Pin Grid Array 针栅阵列 PI Polymide 聚酰亚胺 PIH Plug-In Hole 通孔插装 PTF Plastic Leaded Chip Carrier 塑料有引脚片式载体 PTF Polymer Thick Film 聚合物厚膜 PWB Printed Wiring Board 印刷电路板 PQFP Plastic QFP 塑料QFP QFJ Quad Flat J-leaded Package 四边J形引脚扁平封装 QFP Quad Flat Package 四边引脚扁平封装 QIP Quad In-Line Package 四列直插式封装 RAM Random Access Memory 随机存取存贮器 SBB Stud-Bump Bonding 钉头凸点焊接 SBC Solder-Ball Connection 焊球连接 SCIM Single Chip Integrated Module 单芯片集成模块 SCM Single Chip Module 单芯片组件 SLIM Single Level Integrated Module 单级集成模块 SDIP Shrinkage Dual Inline Package 窄节距双列直插式封装 SEM Sweep Electron Microscope 电子扫描显微镜 SIP Single In-Line Package 单列直插式封装 SIP System In a Package 系统级封装 SMC Surface Mount Component 表面安装元件 SMD Surface Mount Device 表面安装器件 SMP Surface Mount Package 表面安装封装 SMT Surface Mount Technology 表面安装技术 SOC System On Chip 系统级芯片 SOIC Small Outline Integrated Circuit 小外形封装集成电路 SOJ Small Outline J-Lead Package 小外形J形引脚封装 SOP Small Outline Package 小外形封装 SOP System On a Package 系统级封装 SOT Small Outline Transistor 小外形晶体管 SSI Small Scale Integration 小规模集成电路 SSIP Small Outline Single-Line Plug Package 小外形单列直插式封装 SSOP Shrink Small Outline Package 窄节距小外形封装 SPLCC Shrinkage Plasitc Leadless Chip Carrier 窄节距塑料无引脚片式载体 STRAM Selftimed Random Access Memory 自定时随机存取存贮器 SVP Surface Vertical Package 立式表面安装型封装 TAB Tape Automated Bonding 载带自动焊 TBGA Tape BGA 载带BGA TCM Thermal Conduction Module 热导组件 TCP Tape Carrier Package 带式载体封装 THT Through-Hole Technology 通孔安装技术 TO Transistor Outline 晶体管外壳 TPQFP Thin Plastic QFP 薄形塑料QFP TQFP Tape QFP 载带QFP TSOP Thin SOP 薄形SOP TTL Transistor-Transistor Logic 晶体管-晶体管逻辑 UBM lization Under Bump 凸点下金属化 UFPD Ultra Small Pitch Device 超窄节距器件 USOP Ultra SOP 超小SOP USONF Ultra Small Outline Package Non Fin 无散热片的超小外形封装 UV Ultraviolet 紫外光 VHSIC Very High Speed Integrated Circuit 超高速集成电路 VLSI Very Large Scale Integrated Circuit 超大规模集成电路 WB Wire Bonding 引线健合 WLP Wafer Level Package 圆片级封装 WSI Wafer Scale Integration 圆片级规模集成 |
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