美国Alliance Memory公司是2006年从Alliance Semiconductor(1985年成立)分离独立出来的半导体设计制造公司，总部位于美国加州，在英国、德国、法国、意大利、瑞典、北美、南美、日本、台湾、中国等全球许多区域有其销售网点，产品涵盖：SRAM、SDRAM、DDR1、DDR2、DDR3　　美国Alliance Memory公司生产的存储芯片，以超强稳定性的工业级存储器件为主，其SRAM产品系列种类丰富，电源范围3.3V-5V,存储容量64K~32Mb,速度从10~20ns(快速异步SRAM)到55-70 ns(低功耗SRAM)。Alliance公司同时也面向用户提供各种系列SDRAM产品，容量包括：16M \ 64M \ 128M \ 256M \ 512M \ 1G,。这些产品广泛应用于医疗器械、测量仪表、电力监控、便携式抄表、导航测绘、安防等众多领域。

　　Alliance公司产品具有工业级的品质，抗干扰性强，价格低廉，可以完全替代SAMSUNG、MICRON、ISSI、CYPRESS、HYNIX等同类产品型号，且不需要任何设计方面的修改。

     Alliance存储器件广泛应用于工业测量仪表、电力监控、医疗器械、导航测绘、分析仪器、报警器、通讯设备等领域。

64K(x8) –We have a new die rev that is in full production and will not be supporting our mother die except for the existing inventory we have left. We must push the new rev part, AS7C164A-15JCN for all new qualifications and any existing customers that will continue to use this device in the future.

 256K(x8) – we are holding inventory on certain devices and can support product to your customer relatively quick.  Standard lead time is stock to 8 weeks. 

 1M(x8, x16) – we are holding inventory on certain devices and can support product to your customer relatively quick.  Standard lead time is stock to 8 weeks.  Some competitors are being extremely aggressive on this device to clear out inventory. We are considering supporting our B rev with industrial temp.  Sampling is now available on some devices.

 2M(x8, x16) – there is not a big demand worldwide for this device, however we do manufacture and can get parts to your customer in approximately 8 weeks. 

 4M(x8, x16) – we are holding an abundance of both finished goods and WIP inventory on certain devices and can support product to your customer relatively quick.  Standard lead time is stock to 8 weeks. We have seen other suppliers more aggressive on pricing for these devices. 

 One of our biggest strengths as a company is our FSRAM lineup.  These are mature products that we have been supporting for many years.  We have excellent print position

and competitive pricing.  The biggest issue is that we are only producing Lead Free product and some customers may only have leaded qualified.

 We have designed a 4M Fast Asynch 48ball BGA package.  The package will be supported for x16 configuration. 

 AS7C34098A-10BIN

 Available Now!                Data Sheet

Available Now!                 Samples in stock

Available Now!                 Full Production

 We now manufacture an 8ns 4M Fast Asynch SRAM.  Samples/Production available now

 AS7C34098A-8TIN                  AS7C34096A-8TIN

 8M Fast

 We have designed an 8M Fast Asynchronous in both TSOP II and 48ball BGA package.  The package will be supported for both x8 and x16 configuration. 

8M Fast - Sample/Production available now!  .

 Product Line up

 AS7C38098A-10TIN   512K x 16, 10ns, 3.3V 44pin TSOP II

AS7C38098A-10BIN   512K x 16, 10ns, 3.3V 48ball BGA

AS7C38096A-10TIN    1024K x 8 10ns, 3.3V 44pin TSOP II

AS7C38096A-10BIN   1024K x 8 10ns, 3.3V 48ball BGA

 16M FAST

 We now have a 16M Fast SRAM in 48pin TSOP I and 48ball TFBGA packages. 

16M Fast - Sample/Production available now!

 AS7C316098A-10TIN 1024K x 16, 10ns, 3.3V 48pin TSOP I

AS7C316098A-10BIN        1024K x 16, 10ns, 3.3V 48ball TFBGA

 AS7C316096A-10TIN       2048K x 8, 10ns, 3.3V, 48pin TSOP 1

 

LPSRAM (Low Power)

 Competition: Cypress, ISSI, Brilliance, Renesas

 RoHS Compliant

 Products are wide voltage range (2.7V – 5.5V)

 We have built up quite a bit of inventory on certain devices and thus lead times are greatly reduced as well as more competitive pricing can be provided.  It is important that you provide as much detail to us so the appropriate pricing can be given.

  Our goal as always is to not lose any business due to price.

 Pricing has remained relatively flat over the last quarter. We have seen in some cases suppliers have decreased pricing slightly however lead times are staying flat.

 64K(x8) – Market demand is small however customers are still using or may need to design in.  We support DIP, SOP and shrink TSOP packages. Lead time for this device is 8 weeks.

256K(x8) – Market demand is still fairly strong. We support DIP, SOP, and shrink TSOP packages and are holding inventory on some devices with standard lead time being stock to 8 weeks. 

We now have inventory of our low voltage 256K Low Power SRAM.  We will support in a 28pin SOP, 70ns.

 AS62V256A-70SIN     32K x 8, 3V, 70ns, 28pin SOP

Datasheet is available

 1M(x8, x16) – Market demand is strong.  There are still a lot of engineers looking to design in this device.  We support DIP, SOP, TSOP and sTSOP and are holding inventory on some devices with standard lead time being stock to 8 weeks. We have recently added the 128k x 8 36ball TFBGA package (AS6C1008-55BIN)

 2M(x8,x16) – Market demand is small however we have seen a tremendous increase in sample requests due primarily because of BSI has increased price and increased MOQs to their customer thus forcing previous BSI customers to find another source.  We are supporting SOP, TSOP, and sTSOP and TFBGA packages and are holding inventory on some devices with standard lead time being stock to 8 weeks.

 4M(x8) – Market demand is big.  This device is still strong in the minds of design engineers.  They feel comfortable that there are enough suppliers manufacturing this device and the part will be around 10 years from now. We support DIP, SOP, TSOP I, TSOP II, sTSOP packages and are holding inventory on certain devices with standard lead time being stock to 8 weeks.

 4M(x16) – Market demand is big.  Samsung was a major supplier of this part and since they have gotten out of the LPSRAM market and the inventory is running out, customers are in a panic to find this device.  We will support TSOP II and TFBGA packages. 

We are offering a new die rev (A) for the 4M(x16) with a faster access speed of 45ns. AS6C4016A-XXXX is now available for sampling/production volumes.  Please contact our sales/marketing department for samples

 AS6C4016A-45ZIN    256K x 16, 3.3V, TSOP II                                AS6C4016A-45BIN   256K x 16, 3.3V, 48ball BGA

 We are now supporting a new line up of low Voltage 4M(x8) Low Power SRAM.  If your customer needs a voltage range of 3.3V these parts could be the solution providing a more

competitive cost structure.  We will support in all packages, SOP, TSOP I, sTSOP, TSOP II and TFBGA.  Samples and production qtys are available now.

 AS6C4008A-55SIN     512K x 8, 3.3V, SOP

AS6C4008A-55STIN   512K x 8 3.3V, STSOP

AS6C4008A-55ZIN     512K x 8, 3.3V, TSOP II

AS6C4008A-55TIN         512K x 8, 3.3V TSOP I

AS6C4008A-55BIN        512K x 8, 3.3V TFBGA

 8M(x8, x16) - This product is in full production. We will support TSOP II and TFBGA packages.  We will begin to build up inventory and keep stock in our warehouse. There is still a fairly large demand for this device. 

 We are offering a new die rev (A) for the 8M(x16).  AS6C8016A-XXXX is now available for sampling/production volumes.   Please contact our sales/marketing department for samples

 AS6C8016A-55BIN  512K x 16, 3.3V  TFBGA

AS6C8016A-55ZIN   512K x 16, 3.3V TSOP II

 16M(x16) – This product is in full production. We will support the 48ball TFBGA package, 3.3V, 70ns. The 48pin TSOP I package 3.3V 55ns. Competitors on this device are Cypress, ISSI, Renesas and BSI.

 We are offering a new die rev (A) for the 16M(x16) 3,3V – 55ns.  AS6C1616A-XXXX is now available for sampling/production volumes.   Please contact our sales/marketing department for samples

 32M - We are now offering a 32M Low Power SRAM.  This part will be supported in a 48pin TSOP 1 and 48ball TFBGA.  We are in full production and samples are available now.

 AS6C3216-55TIN       2M x 16, 55ns, 3.3V, 48pin TSOP I

AS6C3216-55BIN 2M x 16, 55ns, 3.3V, 48ball TFBGA

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