制造能力manufacture capability |
技术项目technology project |
制造能力manufacture capability |
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产品类型product type |
铝基板aluminium base board |
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表面处理surface treatment |
喷锡HAL/化锡immersion tin /沉锡immersion sliver/化金gold plating/osp |
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层数layers |
1-4层1-4layer |
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最大尺寸maximium dimension |
1100mm*480mm |
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最小尺寸minimium dimension |
5*5mm |
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板翘曲度warp&twist |
小于0.5mm(厚度1。6MM300*300)<0.5mm(thickness :1.6mm dimension 300*300) |
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成品厚度finish product thickness |
0.2-4.5mm |
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铜箔厚度copperfoil thickness |
18um -140um |
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孔内铜厚hole inner copper thickness |
18-40um |
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孔位偏差hole position tolerance |
#NAME? |
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最小冲孔直径minimum punching hole diameter板厚1。0MM以下1。0MMboard thickness<0.1MM |
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最小冲方曹规格the minimum punching square slot specifkation板厚1.0mm以下0.8*0.8mm board thickness<1.0 0.8*0.8mm |
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丝印线路偏差silk prints circuit tolerance cnc锣板:+_0.1mm模冲:+_0.75mm cnc:+_0.1mm mould :+_0.75mm |
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最小孔径mininal aperture |
0.8mm最大孔径不限no limitation in maximum hole dimension for borad over 0.8 |
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v-cut角度偏差v-cut angle deviation |
#NAME? |
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v-cut切割v-cut board thickness range |
0.6-3.2mm |
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最小元件字符minimum open window for PADS0.01MM |
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阻焊类型solder mask types |
绿green 白white 蓝blue 亚光黑blue mattblack灰色grey |
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