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PCB设计中专业英译术语之基材

已有 60 次阅读  2018-04-28 11:03   标签印制板电路  PCB设计  PCB培训  专业术语  综合词汇 
  PCB设计中专业英译术语之基材:
  1. 基材:base material
  2. 层压板:laminate
  3. 覆金属箔基材:metal-clad bade material
  4. 覆铜箔层压板:copper-clad laminate (CCL)
  5. 单面覆铜箔层压板:single-sided copper-clad laminate
  6. 双面覆铜箔层压板:double-sided copper-clad laminate
  7. 复合层压板:composite laminate
  8. 薄层压板:thin laminate
  9. 金属芯覆铜箔层压板:metal core copper-clad laminate
  10. 金属基覆铜层压板:metal base copper-clad laminate
  11. 挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film
  12. 基体材料:basis material
  13. 预浸材料:prepreg
  14. 粘结片:bonding sheet
  15. 预浸粘结片:preimpregnated bonding sheer
  16. 环氧玻璃基板:epoxy glass substrate
  17. 加成法用层压板:laminate for additive process
  18. 预制内层覆箔板:mass lamination panel
  19. 内层芯板:core material
  20. 催化板材:catalyzed board ,coated catalyzed laminate
  21. 涂胶催化层压板:adhesive-coated catalyzed laminate
  22. 涂胶无催层压板:adhesive-coated uncatalyzed laminate
  23. 粘结层:bonding layer
  24. 粘结膜:film adhesive
  25. 涂胶粘剂绝缘薄膜:adhesive coated dielectric film
  26. 无支撑胶粘剂膜:unsupported adhesive film
  27. 覆盖层:cover layer (cover lay)
  28. 增强板材:stiffener material
  29. 铜箔面:copper-clad surface
  30. 去铜箔面:foil removal surface
  31. 层压板面:unclad laminate surface
  32. 基膜面:base film surface
  33. 胶粘剂面:adhesive faec
  34. 原始光洁面:plate finish
  35. 粗面:matt finish
  36. 纵向:length wise direction
  37. 模向:cross wise direction
  38. 剪切板:cut to size panel
  39. 酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
  40. 环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
  41. 环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates
  42. 环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
  43. 环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates
  44. 聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates
  45. 聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates
  46. 双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
  47. 环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates
  48. 聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates
  49. 超薄型层压板:ultra thin laminate
  50. 陶瓷基覆铜箔板:ceramics base copper-clad laminates
  51. 紫外线阻挡型覆铜箔板:UV blocking copper-clad laminates
  以上即是PCB设计中专业英译术语之基材,下期预告:PCB设计中专业英译术语之基材的材料,更多更多行业信息可查阅快点学院订阅号:eqpcb_cp。

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